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| 3-zone furnace | Thermal processes | Thermo scientific | Lindberg Blue M |
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| 4-point probe | Characterization | Jandel | KM3-AR |
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| Acid Wet bench | Wet process benches | - | - |
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| Anechoic chamber | Other processes | Unknown | 2011 |
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| Angstrom - E-beam and thermal PVD | Thin film deposition | Ångstrom Engineering | EvoVac |
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| Atomic layer deposition (ALD) | Plasma deposition | Beneq | TFS 200- 148 |
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| Big blue tube furnace | Thermal processes | Gero | 75242 |
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| Birkeland Tube furnace | Thermal processes | GSL1100X | GSL1100X |
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| Cross Section Polisher | Other processes | Jeol | IB-19520CCP |
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| DC Magnetron sputtering | Thin film deposition | CVC | AST-601, DC system |
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| Ellipsometer | Characterization | Woolam | AlphaSE |
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| Farraday Cage | Other processes | Unknown | 2010 |
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| Forming gas | Sample preparation | AGA | H2/N2 |
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| FT-IR | Characterization | Bruker | IFS 125HR |
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| High resolution powder diffraction | Characterization | Bruker | D8-A25 |
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| Image Plate Diffractometer | Characterization | Huber | G670 |
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| Ion implanter | Other processes | NEC | Tandem Accelerator |
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| IT-300 SEM | Characterization | JEOL | IT-300 |
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| Laser Cutter | Other processes | Roffin | PL E 25 SHG CL Flex |
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| Leybold E-beam evaporation | Thin film deposition | Leybold | L 560 K |
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| Lindberg Tube furnace | Thermal processes | Lindberg | 59544 |
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| Lithography Wet bench | Wet process benches | - | - |
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| Low resolution transmission XRD | Characterization | Bruker | D5000 |
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| Low temperature powder XRD | Characterization | Bruker | D5000 |
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| Mask aligner 2 | Lithography | Karl Suss | MJB55 |
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| Moorfield - DC/RF Magnetron sputter | Thin film deposition | Moorefield | MiniLab |
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| MOVPE / MOCVD | Epitaxy | EMF | Titan Reactor |
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| Multi Purpose Powder X-ray Diffraction | Characterization | Bruker AXS | D8-A25 |
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| NanoPVD - DC/RF Magnetron sputter | Thin film deposition | Moorfield | NanoPVD Model S10A |
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| Network analyzer ZVA67 | Network Analyzer | Rohde & Schwarz | 2013 |
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| Optical Microscope | Other processes | Olympus | BX 41 M |
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| PCB-milling machine | Other processes | LPKF | 2012 |
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| PECVD | Plasma deposition | Advanced Vacuum | Vision 310 MK II |
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| Probe station | Characterization | Wentworth Laboratories | Pegasus S200FA |
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| Probestation with laser cutter | Other processes | Signatone | 2012 |
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| QSSPC | Characterization | Sinton Instruments | WCT-120 + Suns-Voc |
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| Rapid Thermal Processing - Micro | Thermal processes | AnnealSys | AS-Micro |
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| Rapid Thermal Processing - One | Thermal processes | AnnealSys | AS-One |
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| RBS | Characterization | Custom made | - |
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View
| RCA Wet bench | Wet process benches | - | - |
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| Reactive Ion Etch | Dry etching | Advanced Vacuum | Vision 320 MK II |
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| Resist spinner | Lithography | - | CEE 100 |
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| Room temperature Hall (RTH) | Characterization | Lake Shore | EM4 HGA |
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| Routine Powder Diffraction | Characterization | Bruker AXS | D8 Discover |
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| Scanning Probe Microscope | Surface analysis & TEM | Nanonics | MV2000 |
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| Semicore - DC/RF Magnetron sputter | Thin film deposition | Semicore | TriAxis |
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View
| Single crystal X-ray diffraction (dual source) | Characterization | Bruker | D8-Venture |
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| Small Angle Scattering | Characterization | Bruker | Nanostar |
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| Small blue tube furnace | Thermal processes | Gero | - |
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| Solar simulator | Characterization | Newport | 91160 Full Spectrum Solar Simulator |
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| Solvent Wet bench | Wet process benches | - | - |
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| Spectrophotometer | Characterization | Shimadzu | SolidSpe-3700 DUV |
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| Stylus profilometer | Characterization | Veeco | Dektak 8 |
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| Tabletop Maskless Litography/Aligner System | Lithography | Heidelberg instruments | uPG501 |
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| Temperature Dependent Hall | Characterization | LakeShore | HMS 7700A |
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| Temperature Dependent Hall (TDH) | Characterization | LakeShore | EM4 HGA |
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| Temperature Dependent Scanning Probe Microscope | Surface analysis & TEM | Nanonics | MV2000 |
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| Thermal evaporator | Thin film deposition | Balzers | BAE 250 |
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| Thin Film XRD | Characterization | Panalytical | Empyrean |
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| Transmission powder XRD | Characterization | Bruker | D5000 |
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| Tube 1 - 4-stack furnace | Thermal processes | ThermCo | ThermCo |
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| Tube 2 - 4-stack furnace | Thermal processes | ThermCo | ThermCo |
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| Tube 3 - 4-stack furnace | Thermal processes | ThermCo | ThermCo |
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| Tube 4 - 4-stack furnace | Thermal processes | ThermCo | ThermCo |
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| UMS Huginn - FEI Titan 60-300 | Surface analysis & TEM | FEI Company | Titan G2 60-300 |
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| UMS Muninn - JEOL 2100F | Surface analysis & TEM | JEOL | 2100F |
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| Warm cabinet | Thermal processes | - | - |
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| WaveMaster 830Zi Oscilloscope | Other processes | LeCroy | 2010 |
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| Wirebonder | Device mounting | Signatone | 2011 |
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| XRD | Characterization | Bruker | AXS D8 Discover |