Picture of Magnetron sputter DC/RF - NanoPVD
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Responsibles
1st Responsible:
Eirini G. Zacharaki
2nd Responsible:
Simon Cooil
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Description

Instrument model:

 Moorfield NanoPVD

Technology Description:

 Magnetron sputtering is a technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. The NanoPVD offers co-deposition of two targets, and multilayer films without breaking vacuum. The NanoPVD is intended for processes which are "dirty", i.e. all processes which are not epitaxial or involve materials which are not allowed in the Semicore, Moorfield MiniLab or Flextura.

Technical Information:

Sources: 1 DC max power 850W and 1 RF max power 150W.

Target size: 3 x 2”

Substrate size: 4” Single wafer chamber, but smaller samples can be mounted on the sample holder.

Substrate heating: 20 ºC - 600 ºC

Gas: Ar, N2 and O2

Materials: wide range of materials allowed, including metal oxides, metal nitrides and metal coatings. 
Details
Tool name:
Magnetron sputter DC/RF - NanoPVD
Area/room:
MiNaLab Clean Room
Category:
Thin film deposition
Manufacturer:
Moorfield
Model:
NanoPVD Model S10A
Tool rate:
C
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