Material Class:
Technology Description:
Technical Information:
Vertical resolution: 1 Å.
Maximum wafer size: 200 mm (diameter).
Stylus force: programmable, 1 mg - 15 mg.
Stylus options: 2 μm radius.
Stiching capability: yes.
Stress measurements: 2D stress measurement capability.
3D mapping: 3D mapping collection and analysis capability.
Software: Vision ® 64 Operation and Analysis software.