E-beam PVD and thermal evaporation are efficient and user-friendly techniques for depositing high-quality metal contacts, metal- and metal oxide thin films. A crucible containing pellets of the desired material is heated using either an electron beam or resistive heaters to melt the material and cause evaporation. The substrate, mounted in the top of the chamber, will thus be coated with the evaporated material. For applications that require high-quality interfaces and thin films, e-beam PVD is the recommended technique. For each material is a standard recipe available.
Sources: 1 E-beam source.
Low vacuum: below <1x10-7 Torr base pressure.
Load-lock: allows for time-efficient depositions.
Substrate size: 4” wafer chamber, but smaller samples can be mounted on the sample holder.
Multilayered deposition: Multiple layers can be grown without breaking vacuum. The limit of different materials is 8, due to the number of available pockets.
Thin film thickness: down to 10 nm thickness is possible. Upper limit is limited by the amount of material that is in the 12cc crucible.
Materials: Ag, Au, Al, Ni, Cr, SiO2 (For each material is a standard recipe available.)