Material Class:

Technology Description:

Thin film deposition or metallization of surfaces by evaporation of a target using an electron beam. The e-beam evaporator at UiO MiNaLab can sequentially deposit up to 4 materials during one cycle without breaking vacuum.

The maximum allowed thickness is 400 nm. For thicker films consider, sputtering or electroplating.

Technical Information:

DC V 6-12 kV

Beam power: 5 kW at 12 kV

Metals: Al, Ag, Au, Pt, Pd, Si, Ti, Ni

Al, Si and Ni are included in the hourly price, for other metals please contact tool responsible for details.

Ultimate vacuum: < 1 x 10^-6 mbar