Thin film deposition or metallization of surfaces by evaporation of a target using an electron beam. The e-beam evaporator at UiO MiNaLab can sequentially deposit up to 4 materials during one cycle without breaking vacuum.
The maximum allowed thickness is 400 nm. For thicker films consider, sputtering or electroplating.
DC V 6-12 kV
Beam power: 5 kW at 12 kV
Metals: Al, Ag, Au, Pt, Pd, Si, Ti, Ni
Al, Si and Ni are included in the hourly price, for other metals please contact tool responsible for details.
Ultimate vacuum: < 1 x 10-6 mbar