Picture of PECVD
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Halvor Dolva
2nd Responsible:
Viktor Bobal
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Description

Material Class:

  

Technology Description:

 

 The PECVD system is a Plasma-enhanced chemical vapor deposition mainly for deposition of SiO2, Si3N4 and a-Si.

Technical Information:

 Type: Advanced Vacuum Vision 310 MK II

Restrictions: Polymers and organic materials are not allowed in the chamber.

 

Size: Up to12″ wafer size

 

Details
Tool name:
PECVD
Area/room:
Clean Room
Category:
Plasma deposition
Manufacturer:
Advanced Vacuum
Model:
Vision 310 MK II
Tool rate:
D
Booking
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:
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Tool Modes
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