Picture of Reactive Ion Etch
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Halvor Dolva
2nd Responsible:
Christoph Seiffert
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Description

Material Class:

  

Technology Description:

 

 The reactive ion etch (RIE) is an isotropic and directional dry etching for SiO2, Si3N4, Si, polymers and surface plasma treatment.

Technical Information:

 Type: Advanced Vacuum Vision 320 MK IISize: Up to 12″ wafer size

 

Details
Tool name:
Reactive Ion Etch
Area/room:
Clean Room
Category:
Dry etching
Manufacturer:
Advanced Vacuum
Model:
Vision 320 MK II
Tool rate:
C
Booking
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:
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Tool Modes
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