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Reactive Ion Etch (UiO028)
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Halvor Dolva
2nd Responsible:
Christoph Seiffert
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Description
Material Class:
Technology Description:
The reactive ion etch (RIE) is an isotropic and directional dry etching for SiO
2
, Si
3
N
4
, Si, polymers, metals (limited performance) and surface plasma treatment.
Technical Information:
Type
: Advanced Vacuum Vision 320 MK II
Size:
Up to 12″ wafer size
Details
Tool name:
Reactive Ion Etch
Area/room:
Clean Room
Category:
Dry etching
Manufacturer:
Advanced Vacuum
Model:
Vision 320 MK II
Tool rate:
C
Booking
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:
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