Picture of Semicore - DC/RF Magnetron sputter
Current status:
WARNING
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Responsibles
1st Responsible:
Kristin Bergum
2nd Responsible:
Viktor Bobal
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Description

Material Class:

 Available targets: Al, ZnO, SiO2, SiO2,SiO,Cu2,Ag, more targets available on request.

Technology Description:

 

 Magnetron sputtering is a  technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. Two systems are available at UiO-MiNaLab, an older  dc system and a new dc and rf system -multilayer deposition without braking vacuum.

Technical Information:

 Type: Semicore TriAxis

Source: 1 DC max effect 1.2 kW and 2 RF max effect 600 W

3 x 3” Target

4” Single wafer chamber

 

Details
Tool name:
Semicore - DC/RF Magnetron sputter
Area/room:
Clean Room
Category:
Thin film deposition
Manufacturer:
Semicore
Model:
TriAxis
Tool rate:
C
Booking
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:
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Tool Modes
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