Picture of Magnetron sputter DC/RF - Semicore
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Instrument model:

Semicore TriAxis

Technology Description:

Magnetron sputtering is a technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. The Semicore offers co-deposition of three targets, and multilayer films without breaking vacuum. 

Technical Information:

Sources: 1 DC max effect 1.2 kW and 2 RF max effect 600W

Target size: 3 x 3”

Substrate size: 4” Single wafer chamber, but smaller samples can be mounted on the sample holder.

Substrate heating: 20 ºC - 600 ºC

Gas: Ar, N2 and O2

Materials: wide range of materials allowed, mostly used for metal oxides such as ZnO, Cu2O and SnO. 

Tool name:
Magnetron sputter DC/RF - Semicore
MiNaLab Clean Room
Thin film deposition
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