Laser: Air-cooled, solid-state nanosecond pulsed laser (Class 3).
Laser focus: Adjustable laser focus. Z-axis adjustment in increments of 0.01 mm, for cutting through thick (~1-2 mm) samples.
Laser alignment: Secondary HeNe laser to visualize the desired pattern on the sample prior to cutting.
Sample size: Large sample stage (15 x 15 cm2) permits scribing of large wafers in a single run.
In general, samples should be no more than 2 mm thick. Routine cutting processes have been developed for a variety of materials including:
Due to potential damage to the machine, scribing or cutting of materials with higly reflective surfaces is not permitted. For untested materials, please contat the Lab manager to discuss your needs.