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DC Magnetron sputtering (UiO024)
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Available targets: Al, ZnO, ITO. More targets available on request.
Magnetron sputtering is a technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. Two systems are available at UiO-MiNaLab, an older dc system and a new dc and rf system -multilayer deposition without braking vacuum.
: CVC type AST-601
DC Magnetron sputtering
Thin film deposition
AST-601, DC system
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