Picture of DC Magnetron sputtering
Current status:
AVAILABLE
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Material Class:

Available targets: Al, ZnO, ITO.  More targets available on request.

Technology Description:

 

Magnetron sputtering is a  technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. Two systems are available at UiO-MiNaLab, an older dc system and a new dc and rf system -multilayer deposition without braking vacuum.

Technical Information:

Type: CVC type AST-601

 

Tool name:
DC Magnetron sputtering
Area/room:
Clean Room
Category:
Thin film deposition
Manufacturer:
CVC
Model:
AST-601, DC system
Tool rate:
C
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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