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DC Magnetron sputtering (UiO024)
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Viktor Bobal
2nd Responsible:
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Description
Material Class:
Available targets: Al, ZnO, ITO. More targets available on request.
Technology Description:
Magnetron sputtering is a technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. Two systems are available at UiO-MiNaLab, an older dc system and a new dc and rf system -multilayer deposition without braking vacuum.
Technical Information:
Type
: CVC type AST-601
Details
Tool name:
DC Magnetron sputtering
Area/room:
MiNaLab Clean Room
Category:
Thin film deposition
Manufacturer:
CVC
Model:
AST-601, DC system
Tool rate:
C
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