Picture of DC Magnetron sputtering
Current status:
AVAILABLE
Book | Log| 
Show/Collapse all

Responsibles
1st Responsible:
Viktor Bobal
2nd Responsible:
Files
You must be logged in to view files.
Description

Material Class:

 Available targets: Al, ZnO, ITO.  More targets available on request.

Technology Description:

 

 Magnetron sputtering is a  technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. Two systems are available at UiO-MiNaLab, an older dc system and a new dc and rf system -multilayer deposition without braking vacuum.

Technical Information:

 Type: CVC type AST-601

 

Details
Tool name:
DC Magnetron sputtering
Area/room:
MiNaLab Clean Room
Category:
Thin film deposition
Manufacturer:
CVC
Model:
AST-601, DC system
Tool rate:
C
Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
You must be logged in to view tool modes.